Electromagnetic interference shielding using metal and MXene thin films
Joo, K. et al. High performance package-level EMI shielding of Ag epoxy composites with spray method for high frequency FCBGA package application. In Proc. 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 674–680 (IEEE, 2018).Erickson, S. & Sakaguchi, M. Application...









